Advanced Packaging

Focusing on Heterogeneous Integration and Multi-axis Precision Assembly for 2.5D/3D Packaging

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Advantech enables high-precision advanced packaging with scalable edge computing, EtherCAT-based motion control, and high-speed vision. Designed for HBM, die bonding, and precision packaging, these solutions support real-time synchronization, AI-driven inspection, and reliable high-throughput automation.

Benefits

Multi-axis Motion & Vision Alignment HPC

High-speed vision alignment and multi-axis motion computing power for complex packaging and multi-chip stacking such as CoWoS.

EtherCAT Integration & Real-time Connectivity

Integrating EtherCAT bus to achieve precise collaboration among multiple subsystems.

AI-Driven Yield Analysis & Process Feedback

Utilizing AI to analyze packaging outcomes and dynamically feedback to optimize production parameters.

Modular Scalability & Heterogeneous Integration

Supporting flexible expansion of hardware modules to cope with complex heterogeneous packaging demands.

Precise Die Alignment and Real-Time Synchronization

Enable precise die alignment and bonding through real-time vision-motion synchronization and deterministic control.

Vision & Motion
Synchronization

Precise coordination for complex packaging processes.

 

  • High-resolution imaging for die alignment
  • Edge AI-based real-time inspection
  • Deterministic vision-motion synchronization
  • High-precision bonding control

Real-Time Control & Scalable Computing

High-performance processing for demanding packaging equipment.

 

  • EtherCAT-based deterministic control
  • 500 μs–1 ms control cycle time
  • Scalable multi-camera computing
  • High-performance edge and GPU computing

Integrated Packaging
Automation

Flexible infrastructure for advanced packaging equipment.



  • Closed-loop thermal and force feedback
  • Software-based control configuration
  • High-speed industrial connectivity and I/O
  • HMI integration for visualization and operation

Application

  • Chip Packaging Inspection for Back-end Semiconductor

    Vision AI supports high-precision inspection across semiconductor packaging processes, helping identify defects such as cracks, warpage, misalignment, and bonding irregularities. It can also support package marking verification and precise inspection of die bonding, wire bonding, and solder joints, enabling equipment builders to maintain consistent inspection performance across advanced packaging processes.

  • Advantech's Reliable System for Seamless Integration

    Advantech’s industrial computing platforms integrate high-speed data acquisition, frame grabbers, and GPU acceleration to support demanding inspection and alignment applications. Flexible and scalable system architectures enable equipment builders to process high-volume imaging and sensor data while supporting reliable operation in industrial environments.

  • Target Applications: Inspection & Automated Classification

    • Automated inspection and sorting for back-end packaging
    • Final chip inspection for IC's surface, solder joint and bonding quality
    • High-speed and high-resolution area scan
    • Robot vision for defect detection and factory automation

  • Recommended Solution: Hybrid Edge AI Computing

    • PC-based Controller with CPU/GPU computing: Wall-mount IPC with ATX/uATX motherboard, supporting high-end flagship GPU
    • DAQ Cards
    • Frame Grabber Card: 4-ports PCI Express PoE+ GigE Vision Frame Grab supports high-resolution camera integration
    • GPU Card: NVIDIA RTX GPU cards to handle complex AI computations in visual inspections.
    • Industrial AI Camera: Powered over Ethernet (PoE) and high-resolution up to 20 mega pixel CCD/CMOS

Recommended Products

High-Performance Computing & GPU Server

High-Performance computing & GPU Server



Industrial Edge IPC for Seamless Integration

Modular IPC for edge Intelligence and seamless integration


Connectivity

Industrial high-speed connectivity & networking



Automation Control Platform

Real-Time control, motion & high-speed IO



AI AOI & Machine Vision

Industrial AI Camera, powered by NVIDIA system-on-module, embeds high computing power that enables AI programs to process images inside the camera.



HMI Visulization

Industrial HMI & operator interface for Visualization



Case Studies

Semiconductor Equipment Builder in South Asia

A world leader in the supply of semiconductor assembly and packaging equipment and surface mount technology solutions based in South Asia who was looking for reliable industrial computer. Being a long term partner with Advantech, they approached Advantech for an industrial-grade hardware solution.

More Information

Back-end Testing: IC Test Handler Machine Automation Solution

High-end testing and sorting machines in the semiconductor IC packaging sector, such as BGA, QFN, and QFP, have long been monopolized by foreign companies. This customer intended to embrace domestic production of such equipment to reduce order costs, fill the vacuum in the domestic market.

More Information

Modular AI Defect Inspection Solution Makes Semiconductor Equipment Upgrades More Efficient

Since AOI equipment finds defective products by vision inspection, associating with AI for deep learning to adjust conditional expressions can sort defective products, even trace back the cause of errors in the manufacturing process.

More Information

Advantech Use Cases


 

Explore how Advantech’s AI AOI and vision solutions enable faster, more precise semiconductor inspection and metrology.



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