Advanced Packaging

Focusing on Heterogeneous Integration and Multi-axis Precision Assembly for 2.5D/3D Packaging

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Overview

Advantech enables high-precision advanced packaging with scalable edge computing, EtherCAT-based motion control, and high-speed vision. Designed for HBM, die bonding, and precision packaging, these solutions support real-time synchronization, AI-driven inspection, and reliable high-throughput automation.

Benefits

Multi-axis Motion & Vision Alignment HPC

High-speed vision alignment and multi-axis motion computing power for complex packaging and multi-chip stacking such as CoWoS.

EtherCAT Integration & Real-time Connectivity

Integrating EtherCAT bus to achieve precise collaboration among multiple subsystems.

AI-Driven Yield Analysis & Process Feedback

Utilizing AI to analyze packaging outcomes and dynamically feedback to optimize production parameters.

Modular Scalability & Heterogeneous Integration

Supporting flexible expansion of hardware modules to cope with complex heterogeneous packaging demands.

Features

Precise Die Alignment and Real-Time Synchronization
Enable precise die alignment and bonding through real-time vision-motion synchronization and deterministic control.

Vision & Motion Synchronization

Precise coordination for complex packaging processes.

  • High-resolution imaging for die alignment
  • Edge AI-based real-time inspection
  • Deterministic vision-motion synchronization
  • High-precision bonding control

Real-Time Control & Scalable Computing

High-performance processing for demanding packaging equipment.

  • EtherCAT-based deterministic control
  • 500 μs–1 ms control cycle time
  • Scalable multi-camera computing
  • High-performance edge and GPU computing

Integrated Packaging Automation

Flexible infrastructure for advanced packaging equipment.

  • Closed-loop thermal and force feedback
  • Software-based control configuration
  • High-speed industrial connectivity and I/O
  • HMI integration for visualization and operation

Application

  • Chip Packaging Inspection for Back-end Semiconductor

    Vision AI supports high-precision inspection across semiconductor packaging processes, helping identify defects such as cracks, warpage, misalignment, and bonding irregularities. It can also support package marking verification and precise inspection of die bonding, wire bonding, and solder joints, enabling equipment builders to maintain consistent inspection performance across advanced packaging processes.

  • Advantech's Reliable System for Seamless Integration

    Advantech’s industrial computing platforms integrate high-speed data acquisition, frame grabbers, and GPU acceleration to support demanding inspection and alignment applications. Flexible and scalable system architectures enable equipment builders to process high-volume imaging and sensor data while supporting reliable operation in industrial environments.

  • Target Applications: Inspection & Automated Classification

    • Automated inspection and sorting for back-end packaging
    • Final chip inspection for IC's surface, solder joint and bonding quality
    • High-speed and high-resolution area scan
    • Robot vision for defect detection and factory automation

  • Recommended Solution: Hybrid Edge AI Computing

    • PC-based Controller with CPU/GPU computing: Wall-mount IPC with ATX/uATX motherboard, supporting high-end flagship GPU
    • DAQ Cards
    • Frame Grabber Card: 4-ports PCI Express PoE+ GigE Vision Frame Grab supports high-resolution camera integration
    • GPU Card: NVIDIA RTX GPU cards to handle complex AI computations in visual inspections.
    • Industrial AI Camera: Powered over Ethernet (PoE) and high-resolution up to 20 mega pixel CCD/CMOS

Recommended Products


High-Performance Computing & GPU Server

High-Performance computing & GPU Server

Industrial Edge IPC for Seamless Integration

Industrial Edge IPC for Seamless Integration

Connectivity

Industrial high-speed connectivity & networking

Automation Control Platform

Real-Time control, motion & high-speed IO

AI AOI & Machine Vision

Industrial AI Camera, powered by NVIDIA system-on-module, embeds high computing power that enables AI programs to process images inside the camera.

HMI Visulization

Industrial HMI & operator interface for Visualization

Case Studies

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Semiconductor Equipment Builder in South Asia

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Back-end Testing: IC Test Handler Machine Automation Solution

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Modular AI Defect Inspection Solution Makes Semiconductor Equipment Upgrades More Efficient

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